[11] Hermans M J M, Biglari M H. Void formation by Kirkendall effect in solder joints[M]. The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects, 2011:105-122.

[12] Gschohsmann W, Smetana W, Fleischer W. Pore formation in lead-free solders on Cu- and Ag-metallization[C]//International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress of IEEE, 2005: 265-271.