[1] Khattak C P, Shetty R, Schwerdtfeger C R et al. World's largest sapphire for many applications[J]. Journal of Crystal Growth, 452, 44-48(2016). http://www.sciencedirect.com/science/article/pii/S0022024815006946

[2] Akselrod M S, Bruni F J. Modern trends in crystal growth and new applications of sapphire[J]. Journal of Crystal Growth, 360, 134-145(2012). http://www.sciencedirect.com/science/article/pii/S0022024811010578

[3] Gao Huiying. The trends and the state of China's LED substrate[J]. Equipment for Electronic Products Manufacturing, 40, 1-6(2011).

[4] Ji Lingfei, Yan Yinzhou, Bao Yong et al. Research and consideration on laser cutting technique of ceramics[J]. Chinese J Lasers, 35, 1686-1692(2008).

[5] Li Changqing, Wu Wanliang, Zuo Hongbo et al. Analysis of fracture surface for sapphire cut by long pulse laser[J]. Journal of Synthetic Crystals, 39, 997-1001(2010).

[6] Xie Xiaozhu, Huang Xiandong, Chen Weifang et al. Study on scribing of sapphire substrate by pulse green laser irradiation[J]. Chinese J Lasers, 40, 1203010(2013).

[7] Xie Xiaozhu, Gao Xunyin, Chen Weifang et al. Study on scribing parameters of sapphire substrate with pulse green laser[J]. Laser Technology, 38, 632-637(2014).

[8] KopitkovasG,LippertT,DavidC,et al. Surface micromachining of UV transparent materials[J]. Thin Solid Films,2004,453/454:31-35.

[9] Horisawa H, Emura H, Yasunaga N. Surface machining characteristics of sapphire with fifth harmonic YAG laser pulses[J]. Vacuum, 73, 661-666(2004). http://www.sciencedirect.com/science/article/pii/S0042207X0300294X

[10] Cai Zhixiang, Gao Xunyin, Yang Wei et al. Study on fiber laser cutting of sapphire substrate[J]. Laser & Optoelectronics Progress, 52, 081403(2015).

[11] Tamhankar A, Patel R. Optimization of UV laser scribing process for light emitting diode sapphire wafers[J]. Journal of Laser Applications, 23, 032001(2011). http://scitation.aip.org/content/lia/journal/jla/23/3/10.2351/1.3589243

[12] Cao Xiaowen, Zhang Lei, Yu Yongsen et al. Application of micro-optical components fabricated with femtosecond laser[J]. Chinese J Lasers, 44, 0102004(2017).

[13] Xing Songling, Liu Lei, Zou Guisheng et al. Effect of femtosecond laser parameters on hole drilling of silica glass[J]. Chinese J Lasers, 42, 0403001(2015).

[14] He Fei, Cheng Ya. Femtosecond laser micromachining: frontier in laser precision micromachining[J]. Chinese J Lasers, 34, 595-622(2007).

[15] Kasparian J, Sauerbrey R, Chin S L. The critical laser intensity of self-guided light filaments in air[J]. Applied Physics B, 71, 877-879(2000). http://link.springer.com/article/10.1007/s003400000463

[16] Braun A, Korn G, Liu X et al. Self-channeling of high-peak-power femtosecond laser pulses in air[J]. Optics Letters, 20, 73-75(1995). http://www.europepmc.org/abstract/MED/19855801

[17] Garejev N, Majus D et al. . Filamentation and light bullet formation dynamics in solid-state dielectric media with weak, moderate and strong anomalous group velocity dispersion[J]. Journal of Optics, 18, 025502(2015). http://www.ingentaconnect.com/content/iop/jopt2/2016/00000018/00000002/art025502

[18] Brodeur A, Chien C Y, Ilkov F A et al. Moving focus in the propagation of ultrashort laser pulses in air[J]. Optics Letters, 22, 304-306(1997). http://www.ncbi.nlm.nih.gov/pubmed/18183183?dopt=Abstract

[19] Mlejnek M, Wright E M, Moloney J V. Dynamic spatial replenishment of femtosecond pulses propagating in air[J]. Optics Letters, 23, 382-384(1998). http://www.ncbi.nlm.nih.gov/pubmed/18084519

[20] Béjot P, Hertz E, Kasparian J et al. Transition from plasma-driven to Kerr-driven laser filamentation[J]. Physical Review Letters, 106, 243902(2011). http://www.ncbi.nlm.nih.gov/pubmed/21770572

[21] Zergioti I, Kyrkis K D, Papazoglou D G et al. Structural modifications in fused silica induced by ultraviolet fs laser filaments[J]. Applied Surface Science, 253, 7865-7868(2007). http://www.sciencedirect.com/science/article/pii/S0169433207003066

[22] Hosseini S A. -01-19[P]. Herman P R. Method of material processing by laser filamentation: US CA 2805003 A1.(2012).

[23] Wang Yanling, Zhou Xugui, Wu Hong et al. Experimental research of ultraviolet filamentation of intense femtosecond laser in Ar gas[J]. Acta Optica Sinica, 29, 2635-2639(2009).

[24] Wang X C, Lim G C, Zheng H Y et al. Femtosecond pulse laser ablation of sapphire in ambient air[J]. Applied Surface Science, 228, 221-226(2004). http://www.sciencedirect.com/science/article/pii/S0169433204000133

[25] Rapp L, Gamaly E G, Guist R G et al. Ultrafast laser-induced microexplosion: material modification tool[C]. Bragg Gratings, Photosensitivity, and Poling in Glass Waveguides, BT3B, 4(2016).

[26] Liu M Y, Hu Y W, Sun X Y et al. Chemical etching mechanism and properties of microstructures in sapphire modified by femtosecond laser[J]. Applied Physics A, 123, 99(2017). http://link.springer.com/10.1007/s00339-016-0664-9

[27] Hörstmann-Jungemann M, Gottmann J, Wortmann D. Nano- and microstructuring of SiO 2 and sapphire with fs-laser induced selective etching[J]. Journal of Laser Micro/Nanoengineering, 4, 135-140(2009). http://www.researchgate.net/publication/270226207_Nano-_and_Microstructuring_of_SiO2_and_Sapphire_with_Fs-laser_Induced_Selective_Etching

[28] Hörstmann-Jungemann M, Gottmann J, Keggenhoff M. 3D-microstructuring of sapphire using fs-laser irradiation and selective etching[J]. Journal of Laser Micro/Nanoengineering, 5, 145-149(2010). http://www.researchgate.net/publication/45524067_3D-microstructuring_of_sapphire_using_fs-laser_irradiation_and_selective_etching

[29] Juodkazis S, Nishimura K, Misawa H et al. Control over the crystalline state of sapphire[J]. Advanced Materials, 18, 1361-1364(2006). http://onlinelibrary.wiley.com/doi/10.1002/adma.200501837/pdf

[30] Mazilu M, Juodkazis S, Ebisui T et al. Structural characterization of shock-affected sapphire[J]. Applied Physics A, 86, 197-200(2007). http://link.springer.com/article/10.1007/s00339-006-3732-8

[31] Wlodarczyk K L, Brunton A, Rumsby P et al. Picosecond laser cutting and drilling of thin flex glass[J]. Optics and Lasers in Engineering, 78, 64-74(2016). http://www.sciencedirect.com/science/article/pii/S0143816615002146

[32] Stoian R, Ashkenasi D, Rosenfeld A et al. Coulomb explosion in ultrashort pulsed laser ablation of Al 2 O 3[J]. Physical Review B, 62, 13167(2000). http://journals.aps.org/prb/abstract/10.1103/PhysRevB.62.13167

[33] Hu Xiaobao, Hao Qiang, Guo Zhengru et al. Dicing of LED sapphire wafer by using an all fiber picosecond laser[J]. Chinese J Lasers, 44, 0102003(2017).

[34] Ashkenasi D, Kaszemeikat T, Mueller N et al. Machining of glass and quartz using nanosecond and picosecond laser pulses[C]. SPIE, 8243, 82430M(2012).

[35] Moorhouse C. Advantages of picosecond laser machining for cutting-edge technologies[J]. Physics Procedia, 41, 381-388(2013). http://www.sciencedirect.com/science/article/pii/S1875389213001053

[36] Murazawa N, Takahashi K. Ultrafast laser processing and metrology for consumer applications[C]. SPIE, 9351, 935118(2015).

[37] Lott G, Falletto N, Devilder P J et al. Optimizing the processing of sapphire with ultrashort laser pulses[J]. Journal of Laser Applications, 28, 022206(2016). http://scitation.aip.org/content/lia/journal/jla/28/2/10.2351/1.4944509

[39] Ji L F, Yan Y Z, Bao Y et al. Crack-free cutting of thick and dense ceramics with CO 2 laser by single-pass process[J]. Optics and Lasers in Engineering, 46, 785-790(2008). http://www.sciencedirect.com/science/article/pii/S0143816608000821

[40] Brodeur A, Chin S L. Ultrafast white-light continuum generation and self-focusing in transparent condensed media[J]. Journal of the Society of America B, 16, 637-650(1999). http://www.opticsinfobase.org/josab/abstract.cfm?id=35690

[41] de Salvo R, Said A A, Hagan D J et al. . Infrared to ultraviolet measurements of two-photon absorption and n2 wide bandgap solids[J]. IEEE Journal of Quantum Electronics, 32, 1324-1333(1996). http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=511545

[43] Han J C, Li C Q, Zhang M F et al. An investigation of long pulsed laser induced damage in sapphire[J]. Optics & Laser Technology, 41, 339-344(2009). http://www.sciencedirect.com/science/article/pii/S0030399208001047

[44] Li Bo, Shao Lingling. Appraisal of alumina and aluminum hydroxide by XRD[J]. Inorganic Chemicals Industry, 40, 54-57(2008).

[45] Suttmann O, Moalem A, Kling R et al. Drilling, cutting, welding, marking and microforming[M]. //Sugioka K, Meunier M, Piqué A. Laser Precision Microfabrication. Berlin: Springer Berlin Heidelberg, 311-335(2010).