[1] I. Banerjee, J. Electrochem. Soc. 140, 501 (1993).

[2] C. M. Wang, D. R. Baer, J. E. Amonette, M. H. Engelhard, J. J. Antony, and Y. Qiang, Micorsc. Microanal 12, 546 (2006).

[3] S. A. Campbell, The Sctence and Engineering of Microelectronic Fabrication (Oxford University Press, London, 1996).

[4] H. Z. Massoud, J. D. Plummer, and E. A. Irene, J. Electrochem. Soc. 132, 2693 (1985).

[5] N. Cabrera and N. Mott, Rept. Prog. Phys. 12, 163 (1984).

[6] V. P. Parkhuttik, J. Phys. D: Appl. Phys 25, 256 (1992).

[7] V. P. Zhdanov and B Kasemo, Chem. Phys. Lett. 452, 285 (2008).

[8] A. M. Lopez-Beltran and A. Mendoza-Galvan, Thin Solid Film 503, 40 (2006).

[9] S. Moh and F. Placido, in Proceedings of 47th Annual Technical Conference Proceedings of the Society of Vacuum Coaters 443 (2004).

[10] F. Placido and A. Voronov, in Proceedings of the 45th Annual Technical Conference of the Society of Vacuum Coaters 266 (2002).

[11] J. R. Davis, Heat-resistant materials (ASM International, New York, 1997)

[12] J. C. Yang, M. D. Bharadwaj, G. Zhou, and L. Tropia, Microsc. Microanal. 7, 486 (2001).

[13] D. N. Blauch, “Chemical Kinetics, Integrated Rate Laws” http:// www.chm. davidson.edu/ vce/kinetics /IntegratedRateLaws.html (December 1, 2009)