Additive regulated electrochemical microfluidic beam 3D printing

Yong LIU; Shengyang XU; Lixiaoxue CHEN; Wanlu LI; Pengfei DONG

doi:10.37188/OPE.20243213.2091

Journals >Optics and Precision Engineering >Volume 32 >Issue 13 >Page 2091 > Article

Optics and Precision Engineering
Vol. 32, Issue 13, 2091 (2024)

Additive regulated electrochemical microfluidic beam 3D printing

Yong LIU^1,2,*, Shengyang XU¹, Lixiaoxue CHEN¹, Wanlu LI¹, and Pengfei DONG¹

Author Affiliations

¹College of Mechanical， Electrical&Information Engineering， Shandong University， Weihai264209， China

²Associated Engineering Research Center of Mechanics & Mechatronic Equipment， Shandong University， Weihai6409， China

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DOI: 10.37188/OPE.20243213.2091 Cite this Article

Yong LIU, Shengyang XU, Lixiaoxue CHEN, Wanlu LI, Pengfei DONG. Additive regulated electrochemical microfluidic beam 3D printing[J]. Optics and Precision Engineering, 2024, 32(13): 2091 Copy Citation Text

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Fig. 1. Morphology of microfluidic beam deposition with different proportions of additives

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Fig. 2. Finite element simulation model of microbeam electrolysis system

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Fig. 3. Numerical simulation of microbeam electrolysis system deposition of copper columns for 40 minutes（legend indicating the flow velocity of the liquid beam and arrow indicating the current vector）

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Fig. 4. Deposition velocity distribution curves of cathode surface with different deposition heights

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Fig. 5. Schematic diagram of electrochemical 3D printing experimental platform

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Fig. 6. Mean value of factor data and signal-to-noise ratio（SNR）

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Fig. 7. Response surface model of factors A-SPS， B-PEG， C-Cl^- and D-current amplitude to surface roughness

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Fig. 8. Surface roughness with different process parameters

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Fig. 9. Helix structure printed with optimal parameters

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Fig. 10. Spiral structure printed without additives

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SPS/PEG/Cl^-	Morphology characteristics	Formation reasons
Excess SPS	Dark red or black， non-glossy coating in low current density regions； numerous pits in high current density regions	Excess SPS inhibits copper crystallization
Low SPS	Non-glossy in low current density regions， not burnt in high current density regions， small glossy area	Insufficient SPS on the cathode surface to form a glossy area
Excess PEG	Glossy in high and medium current density regions， rough in low current density regions	PEG cannot inhibit hydrogen evolution in low current density regions
Low PEG	Poor leveling and glossiness in high and medium current density regions	The consumption rate of PEG molecules during electrodeposition is less than the diffusion rate of the leveling agent from the solution to the electrode surface
Excess Cl^-	Red deposition morphology in high， medium， and low current density regions	"Chlorine bridge" effect between copper ions and chloride ions increases polarization current
Low Cl^-	Sponge-like burnt appearance in high current density regions	Lack of CuCl^- film formation on the cathode metal surface

Table 1. Single additive variable deposition morphology and formation reasons

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Boundary condition	Boundary	Property
Anode surface	2，8	Φ_s，ext=3 V
Cathode surface	5	Φ_s，ext=0 V
Insulation	3，7	-
Specified normal grid velocity	5	V_n
Zero normal grid velocity	4，6	-
Inlet	1	U₀=1 m/s
Outlet	4，6	-
Steady-state free surface	3，7	-

Table 2. Domain definitions and boundary conditions for microbeam electrolysis system simulation

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Factors	Level 1	Level 2	Level 3
SPS Concentration/10^-6	10	40	70
PEG Concentration/10^-6	50	100	150
Cl^- Concentration/10^-6	30	60	90
CuSO₄/（g·L^-1）	40	70	100
H₂SO₄/（g·L^-1）	150	180	210

Table 3. Value of controllable factors on different levels

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No.	SPS/10^-6	PEG/10^-6	Cl^-/10^-6	CuSO₄/（g·L^-1）	H₂SO₄/（g·L^-1）	Surface-ness/S_a
1	10	50	30	40	150	21
2	10	50	30	70	180	22.68
3	10	50	30	100	210	20.04
4	10	100	60	40	180	11.28
5	10	100	60	70	210	10.68
6	10	100	60	100	150	12.12
7	10	150	90	40	210	22.44
8	10	150	90	70	150	23.64
9	10	150	90	100	180	22.44
10	40	100	90	40	150	14.06
11	40	100	90	70	180	16.53
12	40	100	90	100	210	13.11
13	40	150	30	40	180	17.765
14	40	150	30	70	210	18.715
15	40	150	30	100	150	16.815
16	40	50	60	40	210	16.91
17	40	50	60	70	150	15.58
18	40	50	60	100	180	13.775
19	70	150	60	40	150	20.88
20	70	150	60	70	180	22.08
21	70	150	60	100	210	18.48
22	70	50	90	40	180	17.76
23	70	50	90	70	210	21.36
24	70	50	90	100	150	22.68
25	70	100	30	40	210	12.96
26	70	50	30	70	150	16.44
27	70	50	30	100	180	21.36

Table 4. Orthogonal test result created by Minitab

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Factor	Code		Conversion formula between encoded and real values	Level
Factor	Encoded value	Real value	Conversion formula between encoded and real values	-1	0	1
SPS/10^-6	A	a	A=（a-40）/10	30	40	50
PEG/10^-6	B	b	B=（b-100）/20	80	100	120
$C l^{-}$ /10^-6	C	c	C=（c-60）/20	40	60	80
Current amplitude /mA	D	d	D=（d-7.5）/2.5	5	7.5	10

Table 5. Response surface analysis factors and levels

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No.	SPS/10^-6	PEG/10^-6	Cl^-/10^-6	Current amplitude /mA	Surface roughness /μm	No.	SPS/10^-6	PEG/10^-6	Cl^-/10^-6	Current amplitude /mA	Surface roughness /μm
1	40	100	60	7.5	1.17	15	30	100	40	7.5	15.74
2	50	100	80	7.5	5.59	16	40	100	40	10	5.24
3	40	80	60	10	8.93	17	40	120	60	10	2.54
4	50	100	60	5	10.87	18	40	80	40	7.5	15.24
5	30	80	60	7.5	16.54	19	40	120	60	5	6.04
6	30	100	60	10	9.76	20	40	120	80	7.5	8.34
7	40	100	80	10	6.84	21	30	120	60	7.5	8.88
8	40	120	40	7.5	4.06	22	30	100	80	7.5	11.34
9	40	100	40	5	7.52	23	50	100	60	10	5.56
10	30	100	60	5	8.24	24	40	100	60	7.5	0.07
11	40	100	80	5	6.31	25	50	100	40	7.5	11.24
12	50	120	60	7.5	8.51	26	50	80	60	7.5	11.89
13	40	80	60	5	12.45	27	40	100	60	7.5	0.69
14	40	80	80	7.5	7.42

Table 6. Response surface analysis scheme and test results

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Source	D_f	Mean square	F-value	P-value
Model	14	33.22	13.04	<0.000 1**
A-SPS	1	23.80	9.34	0.010 0*
B-PEG	1	98.04	38.47	<0.000 1**
C-Cl^-	1	14.08	5.53	0.036 7*
D-Current amplitude	1	18.08	5.53	0.036 7*
AB	1	4.84	1.90	0.193 3
AC	1	0.422 5	0.165 8	0.691 1
AD	1	11.56	4.54	0.054 6
BC	1	36.60	14.36	0.002 6**
BD	1	0.010 0	0.003 9	0.951 1
CD	1	2.25	0.882 8	0.366 0
A²	1	207.50	81.42	<0.000 1**
B²	1	113.47	44.52	<0.000 1**
C²	1	78.03	30.62	<0.000 1**
D²	1	21.87	8.58	0.012 6*
Lack of fit test	10	3.00	9.88	0.095 3

Table 7. Results of variance analysis of surface roughness

Yong LIU, Shengyang XU, Lixiaoxue CHEN, Wanlu LI, Pengfei DONG. Additive regulated electrochemical microfluidic beam 3D printing[J]. Optics and Precision Engineering, 2024, 32(13): 2091

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