Theoretical and experimental investigation of chemical mechanical polishing of W–Ni–Fe alloy

Jiang Guo; Xiaolin Shi; Chuanping Song; Lin Niu; Hailong Cui; Xiaoguang Guo; Zhen Tong; Nan Yu; Zhuji Jin; Renke Kang

doi:10.1088/2631-7990/abefb8

[1] Kumari A, Prabhu G, Sankaranarayana M and Nandy T K 2017 Effect of solution treatment temperature and cooling rate on the mechanical properties of tungsten heavy alloy Mater. Sci. Eng. A 688 225–36

[2] Scapin M 2015 Modeling of the heavy tungsten alloy IT180 Int. J. Refract. Met. Hard Mater. 50 258–68

[3] Huang J H, Cao Z W, Zhou G A and Chen H 1999 Computer numerical simulation of mechanical properties of tungsten heavy alloys Trans. Nonferr. Met. Soc. China 9 52–56

[4] Das J, Rao G A, Pabi S K, Sankaranarayana M and Sarma B 2011 Deformation behaviour of a newer tungsten heavy alloy Mater. Sci. Eng. A 528 6235–47

[5] S? ahin Y 2014 Recent progress in processing of tungsten heavy alloys J. Powder Technol. 2014 764306

[6] Arora A and Rao V G 2004 Tungsten heavy alloy for defence applications Mater. Technol. 19 210–5

[7] Tang D W, Zou S L and Yan L 2018 Research on the preparation and shielding properties of W–Ni–Fe alloy material by liquid phase sintering Powder Metall. 61 28–35

[8] Pappu S, Kennedy C, Murr L E, Magness L S and Kapoor D 1999 Microstructure analysis and comparison of tungsten alloy rod and [001] oriented columnar-grained tungsten rod ballistic penetrators Mater. Sci. Eng. A 262 115–28

[9] Miller A C, Brooks K, Smith J and Page N 2004 Effect of the militarily-relevant heavy metals, depleted uranium and heavy metal tungsten-alloy on gene expression in human liver carcinoma cells (HepG2) Mol. Cell. Biochem. 255 247–56

[10] Escobedo J P, Brown E N, Trujillo C P Cerreta E K and Gray III G T 2013 The effect of shock-wave profile on dynamic brittle failure J. Appl. Phys. 113 103506

[11] Ryu H J, Hong S H and Baek W H 2000 Microstructure and mechanical properties of mechanically alloyed and solid-state sintered tungsten heavy alloys Mater. Sci. Eng. A 291 91–96

[12] Neu R, Maier H, Balden M, Dux R, Elgeti S, Gietl H and Team A U 2018 Results on the use of tungsten heavy alloys in the divertor of ASDEX Upgrade J. Nucl. Mater. 511 567–73

[13] Lorenzo P, Miralda M, Iyengar S, Melin S and Noah E 2013 Fatigue properties and characterization of tungsten heavy alloys IT180 & D176 Int. J. Refract. Met. Hard Mater. 41 250–8

[14] Nandam S R, Ravikiran U and Rao A A 2014 Machining of tungsten heavy alloy under cryogenic environment Proc. Mater. Sci. 6 296–303

[15] Suzuki N, Haritani M, Yang J, Hino R and Shamoto E 2007 Elliptical vibration cutting of tungsten alloy molds for optical glass parts CIRP Ann. 56 127–30

[16] Jiang L, Lan Y Q, He Y Y, Li Y, Li Y Z and Luo J B 2014 1,2,4-Triazole as a corrosion inhibitor in copper chemical mechanical polishing Thin Solid Films 556 395–404

[17] Shi X L, Pan G S, Zhou Y, Xu L, Zou C L and Gong H 2015 A study of chemical products formed on sapphire (0001) during chemical–mechanical polishing Surf. Coat. Technol. 270 206–20

[18] Xu W H, Lu X C, Pan G S, Lei Y Z and Luo J B 2010 Ultrasonic flexural vibration assisted chemical mechanical polishing for sapphire substrate Appl. Surf. Sci. 256 3936–40

[19] Aida H, Doi T, Takeda H, Katakura H, Kim S W, Koyama K, Yamazaki T and Uneda M 2012 Ultraprecision CMP for sapphire, GaN, and SiC for advanced optoelectronics materials Curr. Appl. Phys. 12 S41–S46

[20] Lee H S, Jeong H D and Dornfeld D A 2013 Semi-empirical material removal rate distribution model for SiO2 chemical mechanical polishing (CMP) processes Precis. Eng. 37 483–90

[21] Luo J F and Dornfeld D A 2003 Effects of abrasive size distribution in chemical mechanical planarization: modeling and verification IEEE Trans. Semicond. Manuf. 16 469–76

[22] Jeng Y R and Huang P Y 2005 A material removal rate model considering interfacial micro-contact wear behavior for chemical mechanical polishing J. Tribol. 127 190–7

[23] Qin K D, Moudgil B and Park C W 2004 A chemical mechanical polishing model incorporating both the chemical and mechanical effects Thin Solid Films 446 277–86

[24] Paul E, Kaufman F, Brusic V, Zhang J, Sun F and Vacassy R 2005 A model of copper CMP J. Electrochem. Soc. 152 G322

[25] Zhao Y W, Chang L and Kim S H 2003 A mathematical model for chemical–mechanical polishing based on formation and removal of weakly bonded molecular species Wear 254 332–9

[26] Xu Q Z, Chen L, Fang J J and Yang F 2015 A chemical mechanical planarization model for aluminum gate structures Microelectron. Eng. 131 58–67

[27] Wang Y G, Zhao Y W, Jiang J Z, Li X F and Bai J 2008 Modeling effect of chemical–mechanical synergy on material removal at molecular scale in chemical mechanical polishing Wear 265 721–8

[28] Li J, Lu X C, He Y Y and Luo J B 2011 Modeling the chemical–mechanical synergy during copper CMP J. Electrochem. Soc. 158 H197

[29] Ross D and Yamaguchi H 2018 Nanometer-scale Characteristics of polycrystalline YAG ceramic polishing CIRP Ann. 67 349–52

[30] Suzuki H, Okada M, Namba Y and Goto T 2019 Superfinishing of polycrystalline YAG ceramic by nanodiamond slurry CIRP Ann. 68 361–4

[31] Jiao Z H, Kang R K, Dong Z G and Guo J 2019 Microstructure characterization of W-Ni-Fe heavy alloys with optimized metallographic preparation method Int. J. Refract. Met. Hard Mater. 80 114–22

[32] Popov V L 2010 Contact Mechanics and Friction: Physical Principles and Applications (Berlin: Springer)

[33] Zhao Y W and Chang L 2002 A micro-contact and wear model for chemical–mechanical polishing of silicon wafers Wear 252 220–6

[34] He D S, Zhou P, Yan Y, Wang L, Kang R K and Guo D M 2017 Nonlinear compression behavior of the grooved polishing pad: a model and its validation ECS J. Solid State Sci. Technol. 7 178–83

[35] Greenwood J A and Williamson J B P 1966 Contact of nominally flat surfaces Proc. R. Soc. A 295 300–19

[36] Johnson K L 1985 Contact Mechanics (Cambridge: Cambridge University Press)

[37] Jeng Y R and Huang P Y 2004 Impact of abrasive particles on the material removal rate in the chemical-mechanical polishing process: a micro-contact perspective Electrochem. Solid-State Lett. 7 G40–3

[38] Guo J, Song C P, Niu L, Shi X L, Jin Z J, Guo C S and Namba Y 2020 Suppression of grain boundary steps in chemical mechanical polishing of W–Ni–Fe alloy by a citric acid-based slurry Manuf. Lett. 25 40–43

[39] Hu T C, Chiu S Y, Dai B T, Tsai M S, Tung I C and Feng M S 1999 Nitric acid-based slurry with citric acid as an inhibitor for copper chemical mechanical polishing Mater. Chem. Phys. 61 169–71