The encapsulation principle, design method and measurement results of a miniaturized comparator is introduced in this paper. The difficulties of miniaturization and measurement are tackled. A bridge chip is attached on the surface of the Low Temperature Co-fired Ceramic(LTCC) substrate, and the wire is led out from the inside of the substrate to form a test port on the surface of the substrate. Design scheme of miniaturization and high integration is realized based on micro assemble technology. The package shell is designed to realize the airtight package of the comparator and improve the reliability of engineering application. According to the measurement results of the module, the standing wave ratio is less than 1.8, the amplitude consistency is better than ±0.8 dB, the phase consistency is less than 10°, and the mass is 35 g.