• International Journal of Extreme Manufacturing
  • Vol. 3, Issue 3, 35104 (2021)
Yun Chen1、2、*, Yanhui Chen1, Junyu Long1, Dachuang Shi1, Xin Chen1, Maoxiang Hou1, Jian Gao1, Huilong Liu1, Yunbo He1、3, Bi Fan4, Ching-Ping Wong2、5, and Ni Zhao2
Author Affiliations
  • 1State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, School of Electromechnical Engineering, Guangdong University of Technology, Guangzhou 510006, People’s Republic of China
  • 2School of Engineering, The Chinese University of Hong Kong, Shatin, Hong Kong
  • 3Guangdong ADA Intelligent Equipment Ltd, Foshan 510006, People’s Republic of China
  • 4Institute of Business Analysis and Supply Chain Management, College of Management, Shenzhen University, Shenzhen, People’s Republic of China
  • 5School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA 30332, United States of America
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    DOI: 10.1088/2631-7990/abff6a Cite this Article
    Yun Chen, Yanhui Chen, Junyu Long, Dachuang Shi, Xin Chen, Maoxiang Hou, Jian Gao, Huilong Liu, Yunbo He, Bi Fan, Ching-Ping Wong, Ni Zhao. Achieving a sub-10 nm nanopore array in silicon by metal-assisted chemical etching and machine learning[J]. International Journal of Extreme Manufacturing, 2021, 3(3): 35104 Copy Citation Text show less

    Abstract

    Solid-state nanopores with controllable pore size and morphology have huge application potential. However, it has been very challenging to process sub-10 nm silicon nanopore arrays with high efficiency and high quality at low cost. In this study, a method combining metal-assisted chemical etching and machine learning is proposed to fabricate sub-10 nm nanopore arrays on silicon wafers with various dopant types and concentrations. Through a SVM algorithm, the relationship between the nanopore structures and the fabrication conditions, including the etching solution, etching time, dopant type, and concentration, was modeled and experimentally verified. Based on this, a processing parameter window for generating regular nanopore arrays on silicon wafers with variable doping types and concentrations was obtained. The proposed machine-learning-assisted etching method will provide a feasible and economical way to process high-quality silicon nanopores, nanostructures, and devices. Supplementary material for this article is available online
    Yun Chen, Yanhui Chen, Junyu Long, Dachuang Shi, Xin Chen, Maoxiang Hou, Jian Gao, Huilong Liu, Yunbo He, Bi Fan, Ching-Ping Wong, Ni Zhao. Achieving a sub-10 nm nanopore array in silicon by metal-assisted chemical etching and machine learning[J]. International Journal of Extreme Manufacturing, 2021, 3(3): 35104
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