• Optics and Precision Engineering
  • Vol. 31, Issue 24, 3559 (2023)
Youliang WANG1,4,*, Xichun GAO1, Wenjuan ZHANG2, and Jiang GUO3,4
Author Affiliations
  • 1School of Mechanical and Electrical Engineering, Lanzhou University of Technology, Lanzhou730000, China
  • 2State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, Lanzhou University of Technology, Lanzhou730000, China
  • 3School of Mechanical Engineering, Dalian University of Technology, Dalian116024, China
  • 4Ningbo Institute of Dalian University of Technology, Ningbo315016, China
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    DOI: 10.37188/OPE.20233124.3559 Cite this Article
    Youliang WANG, Xichun GAO, Wenjuan ZHANG, Jiang GUO. Influence of water in magnetic compound fluid on polishing performance[J]. Optics and Precision Engineering, 2023, 31(24): 3559 Copy Citation Text show less
    Schematic diagram of MCF polishing device
    Fig. 1. Schematic diagram of MCF polishing device
    Polishing device of MCF polishing process
    Fig. 2. Polishing device of MCF polishing process
    Images of polished surface and measured infrared temperature
    Fig. 3. Images of polished surface and measured infrared temperature
    Surface roughness, decline rate and material removal change with time
    Fig. 4. Surface roughness, decline rate and material removal change with time
    MCF morphologies of different water content before and after polishing
    Fig. 5. MCF morphologies of different water content before and after polishing
    Variation of polishing temperature with time for different components of MCF
    Fig. 6. Variation of polishing temperature with time for different components of MCF
    Normal force of MCF with different water content over time
    Fig. 7. Normal force of MCF with different water content over time
    Formation mechanism of clustered structures with different water content
    Fig. 8. Formation mechanism of clustered structures with different water content
    Changes of surface roughness, decline rate and material removal with polishing time
    Fig. 9. Changes of surface roughness, decline rate and material removal with polishing time
    Morphologies of MCF2 at different polishing time with supplying water
    Fig. 10. Morphologies of MCF2 at different polishing time with supplying water
    Polishing temperature variation of MCF over time with supplementary water
    Fig. 11. Polishing temperature variation of MCF over time with supplementary water
    Normal force variation of MCF over time with supplementary water
    Fig. 12. Normal force variation of MCF over time with supplementary water
    ParametersWorkpiece,L×W×tMagnetMagnet eccentricity, rMagnet rotational speed, nmPolishing head rotational speed, ncVolume of MCF slurry supplied, VWorking gap, Polishing time, t
    ValuePMMA:70 mm×70 mm×1 mmNdFeB N52: Φ 20 mm×h 10 mmB=0.5 T4 mm600 r/m500 r/m1 mL1 mm10 min
    Table 1. Experimental parameters
    MCF slurry(Water content)MF(~10 nm)CIP(~7 μm)Al2O3(~1 μm)α-cellulose
    MCF 1 (40 wt.%)40.8 wt.%44.2 wt.%12 wt.%3 wt.%
    MCF 2 (45 wt.%)45.9 wt.%39.1 wt.%12 wt.%3 wt.%
    MCF 3 (50 wt.%)51 wt.%34 wt.%12 wt.%3 wt.%
    MCF 4 (55 wt.%)56.1 wt.%28.9 wt.%12 wt.%3 wt.%
    Table 2. MCF component
    Youliang WANG, Xichun GAO, Wenjuan ZHANG, Jiang GUO. Influence of water in magnetic compound fluid on polishing performance[J]. Optics and Precision Engineering, 2023, 31(24): 3559
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