• Optics and Precision Engineering
  • Vol. 19, Issue 2, 380 (2011)
DAI Gang*, LU Jian, LIU Jian, ZHANG Liang, and NI Xiao-wu
Author Affiliations
  • [in Chinese]
  • show less
    DOI: Cite this Article
    DAI Gang, LU Jian, LIU Jian, ZHANG Liang, NI Xiao-wu. Experiment of long pulse high energy laser drilling on silica glass[J]. Optics and Precision Engineering, 2011, 19(2): 380 Copy Citation Text show less
    References

    [1] WU D J,NIU F Y,LIU SH, et al.. Borosilicate glass film bending by CO2 CW-laser [J]. Opt. Precision Eng., 2008,16(8):1416-1422.(in Chinese)

    [2] NIKUMB S, CHEN Q, LI C, et al.. Precision glass machining drilling and profile cutting by short pulse lasers [J]. Thin Solid Films, 2005, 477(1-2):216-221.

    [3] JIAO J, WANG X B. A numerical simulation of machining glass by dual CO2 laser beams [J]. Optics & Laser Technology, 2008,40(2):297-301.

    [4] DUBEY A,YADAVA V. Laser beam machining a review[J]. International Journal of Machine Tools and Manufacture, 2008,48(6):609-628.

    [5] SALMAN N,SHEIKH M A, LI L,et al.. Effect of thermal stresses on chip-free diode laser cutting of glass [J]. Optics & Laser Technology, 2009,41(3):318-327.

    [6] WEI R X,JIANG D SH,ZHOU Z D. Relationship between average etching velocity and laser pulse energy density during excimer laser direct etching [J]. Opt. Precision Eng., 2004, 12(2):231-234.(in Chinese)

    [7] EGASHIRA K, MIZUTANI K. Ultrasonic vibration drilling of micro holes in glass [J]. CIRP Annals Manufacturing Technology, 2002,50(1):339-342.

    [8] THORSTEN T,ANDREAS O,CHRISTIAN K, et al.. Precision drilling of fused silica with 157 nm excimer laser radiation [J].SPIE,2003, 4977(40):555-562.

    [9] LAWRENCE S, JESSE T, MARTIN R, et al.. Femtosecond laser deep hole drilling of silicate glasses in air [J]. Applied Surface Science,2001,183(3-4):151-164.

    [10] BOLEY C D, CUTTER K P,FOCHS S N, et al.. Interaction of a high power laser beam with metal sheets [J]. Journal of Applied Physics,2010,107(4):043106-043106.5.

    [11] USOV S V, MINAEV I V. High power impulse YAG laser system for cutting welding and perforating of super hard materials [J]. Journal of Materials Processing Technology,2004, 149(1-3):541-545.

    [12] WU D J,MA G Y,ZHOU Q J,et al.. Experimental study of bending silicon chip with long pulse width laser [J]. Opt. Precision Eng., 2007,15(9):1361-1365.(in Chinese)

    [13] TINTEN K S, von der LINDE. Generation of dense electron hole plasmas in silicon [J]. Phys Rev B, 2000,61(4):2643-2650.

    [14] TINTEN K S, BIALKOWSKI J,LINDE D V. Ultra fast laser-induced order disorder transitions in semiconductors [J]. Phys Rev B, 1995,51(20):14186-14198.

    CLP Journals

    [1] Wang Wenhua, Yu Qingxu, Jiang Xinsheng. CO2 Laser Heating Fusion Welding Technique of Ultra-Thin Fused Silica Glass[J]. Chinese Journal of Lasers, 2012, 39(10): 1003004

    DAI Gang, LU Jian, LIU Jian, ZHANG Liang, NI Xiao-wu. Experiment of long pulse high energy laser drilling on silica glass[J]. Optics and Precision Engineering, 2011, 19(2): 380
    Download Citation