• Optoelectronic Technology
  • Vol. 43, Issue 2, 177 (2023)
Yelu XU
Author Affiliations
  • Xiamen Tianma Microelectronics Co., Ltd., Xiamen Fujian 361000, CHN
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    DOI: 10.19453/j.cnki.1005-488x.2023.02.012 Cite this Article
    Yelu XU. Analysis and Improvement of Corner White Mura in TFT‑LCD[J]. Optoelectronic Technology, 2023, 43(2): 177 Copy Citation Text show less
    Phenomenon of corner white dot
    Fig. 1. Phenomenon of corner white dot
    Data types and analysis tools
    Fig. 2. Data types and analysis tools
    Microscopic phenomenon of corner white Mura
    Fig. 3. Microscopic phenomenon of corner white Mura
    Binary logistic regression analysis
    Fig. 4. Binary logistic regression analysis
    Iron analysis results of TOF-SIMS
    Fig. 5. Iron analysis results of TOF-SIMS
    Curing process of sealant
    Fig. 6. Curing process of sealant
    The guessed mechanism
    Fig. 7. The guessed mechanism
    分析方法现象后续方向
    带偏光片观察电测可见排查是否偏光片干扰
    无偏光片观察电测可见面板相关不良,排查面板

    旋转

    偏光片

    观察

    蓝或黄画面形态变化盒厚相关型不良,排查成盒工艺或PS柱
    蓝或黄画面形态不变化非盒厚相关型不良,排查TFT/CF/成盒工艺
    拆盒观察显微镜可见TFT侧异常TFT相关膜层进一步分析
    显微镜可见CF侧异常CF相关膜层进一步分析
    显微镜未见异常电性或盒内相关

    异常放电

    观察

    不良形态变化电性或盒内相关

    烘烤后

    观察

    不良程度不变化电性相关,排查TFT器件
    不良程度变轻或消失盒内相关
    Table 1. Analysis methods
    验证类别条件不良率/(%)
    对照组正常条件11.50
    液晶滴下方式变更靠近框胶9.80
    远离框胶112.30
    远离框胶29.60
    封框胶调整UV照射时间延长6.80
    UV照射功率增加6.30
    框胶远离金属走线0.10
    Table 2. Experimental conditions and results