Analysis on Tin Spattering of a Micro Solder Joint During Laser Jet Solder Ball Bonding Process

Yue Wu; Gong Chenggong; Zhang Junxi; Bao Ying; Li Jing; Feng Yi

doi:10.3788/CJL202047.0802010

Journals >Chinese Journal of Lasers >Volume 47 >Issue 8 >Page 802010 > Article

Chinese Journal of Lasers
Vol. 47, Issue 8, 802010 (2020)

Analysis on Tin Spattering of a Micro Solder Joint During Laser Jet Solder Ball Bonding Process

Yue Wu^*, Gong Chenggong, Zhang Junxi, Bao Ying, Li Jing, and Feng Yi

Author Affiliations

School of Materials Engineering, Lanzhou Institute of Technology, Lanzhou, Gansu 730050, China

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DOI: 10.3788/CJL202047.0802010 Cite this Article Set citation alerts

Yue Wu, Gong Chenggong, Zhang Junxi, Bao Ying, Li Jing, Feng Yi. Analysis on Tin Spattering of a Micro Solder Joint During Laser Jet Solder Ball Bonding Process[J]. Chinese Journal of Lasers, 2020, 47(8): 802010 Copy Citation Text

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