Typically， abrasive microfracture is a predominant factor affecting fixed abrasive （FA） pad performance. Moreover， the compositions and bonding strengths of the binder determine its microfracture behavior. To realize a highly efficient lapping process， the preparation of silicon-based agglomerated diamond （SAD） abrasives and the effect of the binder composition on lapping performance were investigated. SAD abrasives with various silicon content binders were prepared at 840 ℃， 880 ℃， and 920 ℃， and their micromorphologies were observed using a scanning electron microscope. Lapping tests were conducted on a K9 specimen， and the lapping performance of the aforementioned FA pads at loads of 7， 14， and 21 kPa was compared. The higher the sintering temperature and silicon content of the binder， the more uniform the binder filling， the more reasonable the pore distribution， and the more evident the microbreakage during the SAD grinding process. Under the 21 kPa load， the material removal rate （MRR） of the FA pad with SAD abrasives possessing the highest silicon content and sintered at 920 ℃ was the highest reaching 63.32 μm/min， while the Ra was approximately 0.515 μm. Under the 7 kPa lapping load， the average surface roughness of a workpiece lapped by an FA pad with SAD abrasives possessing the lowest silicon content and sintered at 920 ℃ was the lowest reaching approximately 0.182 μm， while the MRR was 7.89 μm/min. Efficient lapping of K9 optical glass can be achieved using a consolidated SAD abrasive pad.