• Optics and Precision Engineering
  • Vol. 21, Issue 9, 2326 (2013)
XIA Dun-zhu*, KONG Lun, and YU Cheng
Author Affiliations
  • [in Chinese]
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    DOI: 10.3788/ope.20132109.2326 Cite this Article
    XIA Dun-zhu, KONG Lun, YU Cheng. Four-mode matching tri-axis silicon microgyroscope[J]. Optics and Precision Engineering, 2013, 21(9): 2326 Copy Citation Text show less
    References

    [1] ZOTOV S A, MONTGOMERY C R, TRUSOV A A, et al.. Folded MEMS pyramid inertial measurement unit[J]. IEEE Sensors Journal, 2011, 11(11): 2780-2789.

    [2] TSAI N C, SUE C Y. Experimental analysis and characterization of electrostatic-drive tri-axis micro-gyroscope[J]. Sensors and Actuators A, 2010,(158): 231-239.

    [3] PRANDI L, CAMINADA C, CORONATO L, et al.. A low-power 3-axis digital-output MEMS gyroscope with single drive and multiplexed angular rate [C].Proceedings of 2011 IEEE International Solid-State Circuits Conference on Digest of Technical Papers, San Francisco, CA, United states: ISSCC, 2011: 103-105.

    [4] NAKAMURA S. MEMS Inertial sensor toward higher accuracy&multi-axis sensing [C]. Proceedings of the Fourth IEEE Conference on Sensors 2005, Irvine, CA, United states: Proc. IEEE Sens., 2005: 939-942.

    [5] MARTYNENKOA Y G, MERKURIEVB I V, PODALKOVB V V. Dynamics of a ring micromechanical gyroscope in the forced_oscillation mode[J]. Gyroscopy and Navigation, 2010,1(1): 43-51.

    [6] AJIT S, MOHAMMAE F Z, FARROKH A. A sub-0.2 o/hr bias drift micromechanical silicon gyroscope with automatic CMOS mode-matching [J]. Journal of Microelectromechanical Systems, 2009,44(5): 1593-1608.

    [7] ABDOLVAD R, JOHARI H, HOBEAM G K, et al.. Quality factor in trench-refilled polysilicon beam resonators[J]. Journal of Microelectromechanical Systems, 2006,15(3): 471-478.

    [8] FARROKH A, KHALIL N. A HARPSS polysilicon vibrating ring gyroscope [J]. Journal of Microelectromechanical Systems, 2001,10(2): 169-179.

    XIA Dun-zhu, KONG Lun, YU Cheng. Four-mode matching tri-axis silicon microgyroscope[J]. Optics and Precision Engineering, 2013, 21(9): 2326
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