• Acta Physica Sinica
  • Vol. 69, Issue 3, 036201-1 (2020)
Qi Zhu1、2, Sheng-Tao Wang1, Fu-Qi Zhao1, and Hao Pan1、*
Author Affiliations
  • 1Institute of Applied Physics and Computational Mathematics, Beijing 100094, China
  • 2Graduate School of China Academy of Engineering Physics, Beijing 100088, China
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    DOI: 10.7498/aps.69.20191425 Cite this Article
    Qi Zhu, Sheng-Tao Wang, Fu-Qi Zhao, Hao Pan. Effect of stacking fault tetrahedron on spallation of irradiated Cu via molecular dynamics study[J]. Acta Physica Sinica, 2020, 69(3): 036201-1 Copy Citation Text show less
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    Qi Zhu, Sheng-Tao Wang, Fu-Qi Zhao, Hao Pan. Effect of stacking fault tetrahedron on spallation of irradiated Cu via molecular dynamics study[J]. Acta Physica Sinica, 2020, 69(3): 036201-1
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