Hu Xiaobao, Hao Qiang, Guo Zhengru, Zeng Heping. Dicing of Sapphire Wafer with All-Fiber Picosecond Laser[J]. Chinese Journal of Lasers, 2017, 44(1): 102016
- Chinese Journal of Lasers
- Vol. 44, Issue 1, 102016 (2017)
Fig. 1. Schematic of the experimental setup
Fig. 2. Stability of the laser system. (a) Repetition frequency stability, the left inset is the mode locked pulse train at 20 MHz repetition rate, and the right inset shows 8 pulses in a single pulse train at 100 kHz repetition rate; (b) power stability
Fig. 3. (a) Schematic for dicing; (b) schematic for splitting
Fig. 4. Extrinsic feature of chips diced at different average power. (a) 0.27 W; (b) 0.32 W; (c) 0.4 W; (d) 0.5 W
Fig. 5. Extrinsic feature of chips diced by laser with different spot roundness. (a) Less than 80%; (b) about 85%; (c) more than 95%
Fig. 6. Cross sections of chips diced with different number of pulses. (a) 2 pulses; (b) 4 pulses; (c) 6 pulses
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Table 1. Yield rate of LED chips diced with different number of pulses
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