A new technique for rapid 3D microstructure preparation using micropipette is investigated. The tool electrode is made by Pt-Ir wire directly inserted into one or several glass micropipettes arrayed together. This electrode is used as anode, and copper plate or indium tin oxide (ITO) film is used as cathode. Both of them are placed in mixed electrolytes of CuSO4 and H2SO4 for electrochemical microdeposition. To apply voltage between the electrodes, copper microcolumn with controllable diameter and height is successfully deposited into the cathode substrate by lifting the anode in Z direction. Moreover, micropatterns can be made by moving the anode on XY plane, sustaining a gap of a few microns from the substrate. Experiments are carried out to check the feasibility of this method. Microcolumns 50?150 μm in diameter with aspect ratio (height/diameter) that can be greater than 50 are fabricated. Several copper microcolumns that grow simultaneously are obtained. Moreover, lines with micro-width are also fabricated on ITO film. The experimental results indicate that this method is simple, fast, efficient, and can be mass-produced. It can be widely used for micro/nano deposition and processing.