To study the thermal effect of planar waveguide packaging properties,the situation of adhesive bonding is modeled by the finite element method,and the thermal stress and the axial micro-displacements of the adhesive are analyzed.The regular pattern of the adhesive stress birefringence is calculated qualitatively based on the basis of the photo-elastic theory,and the results show that the edge of the bonding interface region is the most sensitive to temperature change.The optical power loss generated from the axial micro-shifts is also proposed by beam propagation method,and if the excess loss is 0.15 dB.It is found that the thickness of the adhesive should be less than 16 μm.The influences of package performance following temperature changes and different thickness of the adhesive under the same conditions are also summarized.