• Chinese Physics B
  • Vol. 29, Issue 10, (2020)
Yi-Fan Xie1、2, Feng Feng1, Ying-Jun Li2、†, Zhi-Qiang Hu3, Jian-Li Shao3, and Yong Mei3、4
Author Affiliations
  • 1School of Science, China University of Mining and Technology, Beijing 00083, China
  • 2State Key Laboratory for Geomechanics and Deep Underground Engineering, China University of Mining and Technology, Beijing 100083, China
  • 3State Key Laboratory of Explosion Science and Technology, Beijing Institute of Technology, Beijing 100081, China
  • 4Institute of Defense Engineering, AMS, PLA, Beijing 100036, China
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    DOI: 10.1088/1674-1056/aba5fe Cite this Article
    Yi-Fan Xie, Feng Feng, Ying-Jun Li, Zhi-Qiang Hu, Jian-Li Shao, Yong Mei. Mechanical and microstructural response of densified silica glass under uniaxial compression: Atomistic simulations[J]. Chinese Physics B, 2020, 29(10): Copy Citation Text show less

    Abstract

    We investigate the mechanical and microstructural changes of the densified silica glass under uniaxial loading-unloading via atomistic simulations with a modified BKS potential. The stress–strain relationship is found to include three respective stages: elastic, plastic and hardening regions. The bulk modulus increases with the initial densification and will undergo a rapid increase after complete densification. The yield pressure varies from 5 to 12 GPa for different densified samples. In addition, the Si–O–Si bond angle reduces during elastic deformation under compression, and 5-fold Si will increase linearly in the plastic deformation. In the hardening region, the peak splitting and the new peak are both found on the Si–Si and O–O pair radial distribution functions, where the 6-fold Si is increased. Instead, the lateral displacement of the atoms always varies linearly with strain, without evident periodic characteristic. As is expected, the samples are permanently densified after release from the plastic region, and the maximum density of recovered samples is about 2.64 g/cm3, which contains 15 % 5-fold Si, and the Si–O–Si bond angle is less than the ordinary silica glass. All these findings are of great significance for understanding the deformation process of densified silica glass.
    Yi-Fan Xie, Feng Feng, Ying-Jun Li, Zhi-Qiang Hu, Jian-Li Shao, Yong Mei. Mechanical and microstructural response of densified silica glass under uniaxial compression: Atomistic simulations[J]. Chinese Physics B, 2020, 29(10):
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