• Chinese Optics Letters
  • Vol. 12, Issue s2, S22201 (2014)
Fan Di1、2
Author Affiliations
  • 1Key Laboratory of Optical System Advanced Manufacturing Technology, Chinese Academy of Sciences, Changchun 130033, China
  • 2Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun 130033, China
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    DOI: 10.3788/col201412.s22201 Cite this Article Set citation alerts
    Fan Di. Study on the material-remove mechanism of SiC surface polishing[J]. Chinese Optics Letters, 2014, 12(s2): S22201 Copy Citation Text show less

    Abstract

    As aerospace technology develops rapidly, higher demand for aerospace optic system is brought forward. With its excellent physical qualities, SiC becomes a very promising material for speculums. The material-remove mechanism of SiC surface polishing is studied, that is, the grinding mechanism of ceramic material. Indentation fracture model is also introduced and is used to explain material-remove mechanism of SiC surface polishing, and the model of SiC polishing in ideal condition is analyzed. Finally, the material-remove mechanism of SiC polishing in real state is studied.
    Fan Di. Study on the material-remove mechanism of SiC surface polishing[J]. Chinese Optics Letters, 2014, 12(s2): S22201
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