Simulation and Experimental Research on Flat Top Femtosecond Laser Grooving of Silicon Wafer

Zhe Zhang; Qi Song; Kunpeng Zhang; Mei Xue; Yu Hou; Zichen Zhang

doi:10.3788/CJL230518

[1] Atabaki A H, Moazeni S, Pavanello F et al. Integrating photonics with silicon nanoelectronics for the next generation of systems on a chip[J]. Nature, 556, 349-354(2018).

[2] Jiang Y W, Li X J, Liu B et al. Rational design of silicon structures for optically controlled multiscale biointerfaces[J]. Nature Biomedical Engineering, 2, 508-521(2018).

[3] Wang J K, Daineka D, Elyaakoubi M et al. Microcrystalline silicon thin film deposition from silicon tetrafluoride: isolating role of ion energy using tailored voltage waveform plasmas[J]. Solar Energy Materials and Solar Cells, 190, 65-74(2019).

[4] Yin Y K, Gao Y F, Li X Y et al. Experimental study on slicing photovoltaic polycrystalline silicon with diamond wire saw[J]. Materials Science in Semiconductor Processing, 106, 104779(2020).

[5] Li H S, Gao Y F, Ge P Q et al. Study on process parameters of fabrication fine diameter electroplated diamond wire for slicing crystalline silicon solar cell[J]. The International Journal of Advanced Manufacturing Technology, 106, 3153-3175(2020).

[6] Samant A N, Dahotre N B. Laser machining of structural ceramics: a review[J]. Journal of the European Ceramic Society, 29, 969-993(2009).

[7] Rihakova L, Chmelickova H. Laser micromachining of glass, silicon, and ceramics[J]. Advances in Materials Science and Engineering, 2015, 1-6(2015).

[8] Bao J D, Long Y H, Tong Y Q et al. Experiment and simulation study of laser dicing silicon with water-jet[J]. Applied Surface Science, 387, 491-496(2016).

[9] Podpod A, Inoue F, De Wolf I et al. Investigation of advanced dicing technologies for ultra low-k and 3D integration[C], 1247-1258(2016).

[10] Kumagai M, Uchiyama N, Ohmura E et al. Advanced dicing technology for semiconductor wafer: stealth dicing[J]. IEEE Transactions on Semiconductor Manufacturing, 20, 259-265(2007).

[11] Suzuki N, Ohba T, Kondo Y et al. High throughput and improved edge straightness for memory applications using stealth dicing[C], 2180-2185(2018).

[12] Ohmura E, Kumagai M, Nakano M et al. Analysis of processing mechanism in stealth dicing of ultra thin silicon wafer[J]. Proceedings of International Conference on Leading Edge Manufacturing in 21st Century: LEM21, 4, 9D435(2007).

[13] Kumagai M, Sakamoto T, Ohmura E. Laser processing of doped silicon wafer by the Stealth Dicing[C](2008).

[14] Zhang H Z, Xu J M, Zhang L T et al. Algorithm and experiment of silicon wafer multifocus laser stealth dicing[J]. Chinese Journal of Lasers, 49, 0202018(2022).

[15] Galasso G, Kaltenbacher M, Tomaselli A et al. A unified model to determine the energy partitioning between target and plasma in nanosecond laser ablation of silicon[J]. Journal of Applied Physics, 117, 123101(2015).

[16] Noh J, Kim J H, Sohn H et al. Comparison of bending fracture strength of silicon after ablation with nanosecond and picosecond lasers[J]. The International Journal of Advanced Manufacturing Technology, 84, 2029-2036(2016).

[17] Ali J M Y, Shanmugam V, Khanna A et al. Analysis of nanosecond and femtosecond laser ablation of rear dielectrics of silicon wafer solar cells[J]. Solar Energy Materials and Solar Cells, 192, 117-122(2019).

[18] de Menezes R F, Harvey C M, de Martínez Gerbi M E M et al. Fs-laser ablation of teeth is temperature limited and provides information about the ablated components[J]. Journal of Biophotonics, 10, 1292-1304(2017).

[19] Ngoi B K A, Venkatakrishnan K, Lim E N L et al. Effect of energy above laser-induced damage thresholds in the micromachining of silicon by femtosecond pulse laser[J]. Optics and Lasers in Engineering, 35, 361-369(2001).

[20] Fornaroli C, Holtkamp J, Gillner A. Dicing of thin silicon wafers with ultra-short pulsed lasers in the range from 200 fs up to 10 ps[J]. Journal of Laser Micro, 10, 229-233(2015).

[21] Mottay E, Liu X B, Zhang H B et al. Industrial applications of ultrafast laser processing[J]. MRS Bulletin, 41, 984-992(2016).

[22] Crawford T H R, Borowiec A, Haugen H K. Femtosecond laser micromachining of grooves in silicon with 800 nm pulses[J]. Applied Physics A, 80, 1717-1724(2005).

[23] Domke M, Egle B, Piredda G et al. Ultrashort pulse laser dicing of thin Si wafers: the influence of laser-induced periodic surface structures on the backside breaking strength[J]. Journal of Micromechanics and Microengineering, 26, 115004(2016).

[24] Amer M S, El-Ashry M A, Dosser L R et al. Femtosecond versus nanosecond laser machining: comparison of induced stresses and structural changes in silicon wafers[J]. Applied Surface Science, 242, 162-167(2005).

[25] Shi K W, Yow K Y, Lo C. Single & multi beam laser grooving process parameter development and Die strength characterization for 40 nm node low-K/ULK wafer[C], 752-759(2015).

[26] Glezer E N, Huang L, Siegal Y et al. Phase transitions induced by femtosecond pulses[J]. MRS Online Proceedings Library, 397, 3-20(1995).

[27] Domke M, Egle B, Stroj S et al. Ultrafast-laser dicing of thin silicon wafers: strategies to improve front- and backside breaking strength[J]. Applied Physics A, 123, 746(2017).

[28] Taylor L L, Scott R E, Qiao J. Integrating two-temperature and classical heat accumulation models to predict femtosecond laser processing of silicon[J]. Optical Materials Express, 8, 648-658(2018).