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    Journals >Electronics and Packaging

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    Regulation Study of Stress Buffer Layer on the Internal Stress and Reliability of Glass Substrate Hole-Filling Structures
    WANG Zhanbo, ZHANG Zexi, YANG Bin, GUO Xu, YANG Guannan, ZHANG Yu, HUANG Guanghan, and CUI Chengqiang
    • Electronics and Packaging
    • Vol. 25, Issue 7, 70103 (2025)
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    Research Progress of Glass-Based Bonding Technology
    FU Juefeng, CHEN Hongwei, LIU Jinxu, and ZHANG Jihua
    • Electronics and Packaging
    • Vol. 25, Issue 7, 70102 (2025)
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    Method and Simulation Analysis of Inorganic Buffer Layer for Reducing TGV Stress in Glass Substrate
    ZHAO Quanlu, ZHAO Jingyi, DING Shanjun, WANG Qidong, CHEN Chuan, and YU Zhongyao
    • Electronics and Packaging
    • Vol. 25, Issue 7, 70108 (2025)
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    Research Status of Through Glass Via Technology and Its Reliability
    MA Bingxu, WANG Haozhong, ZHONG Xiangxiang, XIANG Junshan, LIU Peijiang, ZHOU Bin, and YANG Xiaofeng
    • Electronics and Packaging
    • Vol. 25, Issue 7, 70106 (2025)
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    CBGA Solder Joint Life Prediction Technology Based on Test and Simulation
    LI Jie, CAO Shibo, YU Wei, LI Zeyuan, QIAO Zhizhuang, LIU Linjie, ZHANG Zhaofu, LIU Sheng, and GUO Yuzheng
    • Electronics and Packaging
    • Vol. 25, Issue 7, 70201 (2025)
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    Advances in Radio Frequency Integration Applications of Through Glass Via Technology
    YU Tian, CHEN Xin, LIN Jingyu, ZHONG Yi, LIANG Junge, GU Xiaofeng, and YU Daquan
    • Electronics and Packaging
    • Vol. 25, Issue 7, 70101 (2025)
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